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dc.contributor.authorHo, Yingchiehen_US
dc.contributor.authorChen, Hung-Kaien_US
dc.contributor.authorSu, Chauchinen_US
dc.date.accessioned2014-12-08T15:36:16Z-
dc.date.available2014-12-08T15:36:16Z-
dc.date.issued2012-06-01en_US
dc.identifier.issn2156-3357en_US
dc.identifier.urihttp://dx.doi.org/10.1109/JETCAS.2012.2193841en_US
dc.identifier.urihttp://hdl.handle.net/11536/24593-
dc.description.abstractThis paper investigates the performance of the interconnects with repeater insertion in the subthreshold region. A 3X complementary metal-oxide-semiconductor (CMOS) predriver and a 4X one are proposed to enhance the driving capability. As compared to the conventional repeater, the proposed ones have higher energy efficiency. In addition, the results of Monte Carlo analysis indicate that the propose predrivers have higher concentration under the process and temperature variation than conventional one at 0.15 V. A test chip with 3X and 4X predrivers for 10-mm on-chip bus has been fabricated in 65 nm SPRVT CMOS process. The measured results show that the 3X (4X) predrivers can achieve 5 Mb/s (1.5 Mb/s) data rate at 0.15 V with an efficiency of 35.2 fJ (32.8 fJ).en_US
dc.language.isoen_USen_US
dc.titleEnergy-Effective Sub-Threshold Interconnect Design Using High-Boosting Predriversen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/JETCAS.2012.2193841en_US
dc.identifier.journalIEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMSen_US
dc.citation.volume2en_US
dc.citation.issue2en_US
dc.citation.spage307en_US
dc.citation.epage313en_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.department電控工程研究所zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
Appears in Collections:Articles