標題: | Numerical modeling of interconnect flow channel design and thermal stress analysis of a planar anode-supported solid oxide fuel cell stack |
作者: | Wei, S. -S. Wang, T. -H. Wu, J. -S. 機械工程學系 Department of Mechanical Engineering |
關鍵字: | SOFC;CFD;thermal stress;stack;interconnect |
公開日期: | 1-五月-2014 |
摘要: | In this paper, we propose a new design of flow channel and stack arrangement based on the numerical study considering the effect of the flow channel design on the stack performance and analyze the thermal stress of a planar anode-supported solid oxide fuel cell stack. We also attempt to simplify the cell stack design without affecting its performance and propose an easier sealing method of cell stacks through the study of the thermal stress distribution. The results indicate that the new design, created by changing the cathode flow channel to a porous current collector, with a 6.3% increase in power density. an 8.6% increase in electrical efficiency. Both more uniform flow and current density distribution can be obtained as compared with a conventional counter-flow design. In addition, we propose a new design direction of cell stack, which could be simpler and easier to fabricate, in which material can easily undertake the resulting stress based on the thermal stress analysis. (C) 2014 Elsevier Ltd. All rights reserved. |
URI: | http://dx.doi.org/10.1016/j.energy.2014.03.052 http://hdl.handle.net/11536/24722 |
ISSN: | 0360-5442 |
DOI: | 10.1016/j.energy.2014.03.052 |
期刊: | ENERGY |
Volume: | 69 |
Issue: | |
起始頁: | 553 |
結束頁: | 561 |
顯示於類別: | 期刊論文 |