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dc.contributor.authorHsieh, Ting-Enen_US
dc.contributor.authorChang, Edward Yien_US
dc.contributor.authorSong, Yi-Zuoen_US
dc.contributor.authorLin, Yueh-Chinen_US
dc.contributor.authorWang, Huan-Chungen_US
dc.contributor.authorLiu, Shin-Chienen_US
dc.contributor.authorSalahuddin, Sayeefen_US
dc.contributor.authorHu, Chenming Calvinen_US
dc.date.accessioned2014-12-08T15:36:34Z-
dc.date.available2014-12-08T15:36:34Z-
dc.date.issued2014-07-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2014.2321003en_US
dc.identifier.urihttp://hdl.handle.net/11536/24913-
dc.description.abstractIn this letter, a gate recessed normally OFF AlGaN/GaN MIS-HEMT with low threshold voltage hysteresis using Al2O3/AlN stack gate insulator is presented. The trapping effect of Al2O3/GaN interface was effectively reduced with the insertion of 2-nm AlN thin interfacial passivation layer grown by plasma enhanced atomic layer deposition. The device exhibits a threshold voltage of +1.5 V, with current density of 420 mA/mm, an OFF-state breakdown voltage of 600 V, and high ON/OFF drain current ratio of similar to 10(9).en_US
dc.language.isoen_USen_US
dc.subjectGaNen_US
dc.subjectmetal-insulator-semiconductor high electron-mobility transistor (MIS-HEMT)en_US
dc.subjectnormally-OFFen_US
dc.subjectgate recesseden_US
dc.subjectgate insulatoren_US
dc.subjectthreshold voltage hysteresisen_US
dc.subjectAl2O3 and AlNen_US
dc.subjectplasma enhanced atomic layer deposition (PE-ALD)en_US
dc.subjectinterfacial passivation layer (IPL)en_US
dc.titleGate Recessed Quasi-Normally OFF Al2O3/AlGaN/GaN MIS-HEMT With Low Threshold Voltage Hysteresis Using PEALD AlN Interfacial Passivation Layeren_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2014.2321003en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume35en_US
dc.citation.issue7en_US
dc.citation.spage732en_US
dc.citation.epage734en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
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