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dc.contributor.authorHuang, Yi-Saen_US
dc.contributor.authorLiu, Chien-Minen_US
dc.contributor.authorChiu, Wei-Lanen_US
dc.contributor.authorChen, Chihen_US
dc.date.accessioned2014-12-08T15:36:40Z-
dc.date.available2014-12-08T15:36:40Z-
dc.date.issued2014-10-15en_US
dc.identifier.issn1359-6462en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.scriptamat.2014.06.008en_US
dc.identifier.urihttp://hdl.handle.net/11536/25021-
dc.description.abstractThe grain growth of pulse-plated (111)-oriented nanotwinned Cu (nt-Cu) was investigated at 200-350 degrees C. The results indicate that after the annealing, the nt-Cu exhibits good thermal stability, and columnar grains with a (111)-oriented nt-Cu structure are maintained up to 300 degrees C. The columnar grains consume the original fine-grained region at the bottom of the sample. In addition, these fine grains were converted into nanotwinned columnar grains with a (111) orientation. The electroplated Cu film possessed extremely high (111) preferred orientation after the annealing. (C) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectGrain growthen_US
dc.subjectNanotwinned Cuen_US
dc.subjectPreferred orientationen_US
dc.subjectElectroplated Cuen_US
dc.titleGrain growth in electroplated (111)-oriented nanotwinned Cuen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.scriptamat.2014.06.008en_US
dc.identifier.journalSCRIPTA MATERIALIAen_US
dc.citation.volume89en_US
dc.citation.issueen_US
dc.citation.spage5en_US
dc.citation.epage8en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000340978400002-
dc.citation.woscount0-
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