Grain growth in electroplated (111)-oriented nanotwinned Cu

doi:10.1016/j.scriptamat.2014.06.008

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DC 欄位	值	語言
dc.contributor.author	Huang, Yi-Sa	en_US
dc.contributor.author	Liu, Chien-Min	en_US
dc.contributor.author	Chiu, Wei-Lan	en_US
dc.contributor.author	Chen, Chih	en_US
dc.date.accessioned	2014-12-08T15:36:40Z	-
dc.date.available	2014-12-08T15:36:40Z	-
dc.date.issued	2014-10-15	en_US
dc.identifier.issn	1359-6462	en_US
dc.identifier.uri	http://dx.doi.org/10.1016/j.scriptamat.2014.06.008	en_US
dc.identifier.uri	http://hdl.handle.net/11536/25021	-
dc.description.abstract	The grain growth of pulse-plated (111)-oriented nanotwinned Cu (nt-Cu) was investigated at 200-350 degrees C. The results indicate that after the annealing, the nt-Cu exhibits good thermal stability, and columnar grains with a (111)-oriented nt-Cu structure are maintained up to 300 degrees C. The columnar grains consume the original fine-grained region at the bottom of the sample. In addition, these fine grains were converted into nanotwinned columnar grains with a (111) orientation. The electroplated Cu film possessed extremely high (111) preferred orientation after the annealing. (C) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.	en_US
dc.language.iso	en_US	en_US
dc.subject	Grain growth	en_US
dc.subject	Nanotwinned Cu	en_US
dc.subject	Preferred orientation	en_US
dc.subject	Electroplated Cu	en_US
dc.title	Grain growth in electroplated (111)-oriented nanotwinned Cu	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1016/j.scriptamat.2014.06.008	en_US
dc.identifier.journal	SCRIPTA MATERIALIA	en_US
dc.citation.volume	89	en_US
dc.citation.issue		en_US
dc.citation.spage	5	en_US
dc.citation.epage	8	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000340978400002	-
dc.citation.woscount	0	-
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