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dc.contributor.authorChand, Umeshen_US
dc.contributor.authorHuang, Chun-Yangen_US
dc.contributor.authorTseng, Tseung-Yuenen_US
dc.date.accessioned2014-12-08T15:36:57Z-
dc.date.available2014-12-08T15:36:57Z-
dc.date.issued2014-10-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2014.2345782en_US
dc.identifier.urihttp://hdl.handle.net/11536/25356-
dc.description.abstractIn this letter, the switching mechanism of the ZrO2-based RRAM devices with the uniform and reliable reliability properties is investigated. The stability of memory window can be improved by inserting a ZnO thin film with the nonstoichiometric property between Ti top electrode and ZrO2 layer. Compared with ZrO2 film, the ZnO one can easily perform the oxidation-reduction reaction for stable endurance properties. In addition, through Gibbs free energy comparison of TiOx, ZrO2, and ZnO, we can demonstrate that the Gibbs free energy contributes to the retention performance. The device with thin ZnO layer has stable retention performance at high temperature (200 degrees C) due to its higher Gibbs free energy value than TiOx.en_US
dc.language.isoen_USen_US
dc.titleMechanism of High Temperature Retention Property (up to 200 degrees C) in ZrO2-Based Memory Device With Inserting a ZnO Thin Layeren_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2014.2345782en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume35en_US
dc.citation.issue10en_US
dc.citation.spage1019en_US
dc.citation.epage1021en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000343011300015-
dc.citation.woscount1-
Appears in Collections:Articles