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dc.contributor.authorChang, Sheng-Chiehen_US
dc.contributor.authorHsieh, Cheng-Yuen_US
dc.contributor.authorLin, Bo-Wenen_US
dc.contributor.authorCho, Hsin-Juen_US
dc.contributor.authorHsu, Wen-Chingen_US
dc.contributor.authorWu, YewChung Sermonen_US
dc.date.accessioned2014-12-08T15:36:59Z-
dc.date.available2014-12-08T15:36:59Z-
dc.date.issued2014-01-01en_US
dc.identifier.issn2162-8742en_US
dc.identifier.urihttp://dx.doi.org/10.1149/2.0111410sslen_US
dc.identifier.urihttp://hdl.handle.net/11536/25401-
dc.description.abstractA simple liquid phase deposition (LPD) method was used to introduce nano SiO2 on sapphire substrates to fabricate nano-patterned sapphire substrates with top oxide layers (MNPSS). The X-ray diffraction (XRD) rocking curves and etching pit density (EPD) analyses show that the quality of MNPSS-GaN was better than that of GaN grown on flat sapphire substrates (FLAT-GaN). The photoluminescence (PL) spectrums showed a blueshift of MNPSS-GaN peak position compared with FLAT-GaN. The analyses of XRD reciprocal space map (RSM) revealed that this shift was caused by the residual stress. (C) 2014 The Electrochemical Society. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleReduced Residual Stress and Enhanced Performance of GaN-Based LEDs Prepared by Liquid Phase Deposition Silicon Oxide-Nano Patterned Sapphire Substrateen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/2.0111410sslen_US
dc.identifier.journalECS SOLID STATE LETTERSen_US
dc.citation.volume3en_US
dc.citation.issue11en_US
dc.citation.spageR53en_US
dc.citation.epageR55en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000343251200010-
dc.citation.woscount0-
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