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dc.contributor.authorChang, TKen_US
dc.contributor.authorLin, CWen_US
dc.contributor.authorTsai, CCen_US
dc.contributor.authorLu, JHen_US
dc.contributor.authorChen, BTen_US
dc.contributor.authorCheng, HCen_US
dc.date.accessioned2014-12-08T15:37:06Z-
dc.date.available2014-12-08T15:37:06Z-
dc.date.issued2005en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://hdl.handle.net/11536/25474-
dc.identifier.urihttp://dx.doi.org/10.1149/1.1830372en_US
dc.description.abstractIn this work, high-performance polycrystalline Si thin film transistors have been fabricated by excimer laser crystallization of an amorphous Si film deposited on an array of amorphous Si spacers. The amorphous Si spacers served as seeds for lateral growth during excimer laser irradiation. Large longitudinal grains could be found in the device channel regions. In consequence, the thin-film transistors fabricated with Si spacer structure exhibited a high field-effect mobility of 288 cm(2)/V-s while the mobility of the conventional counterpart was 129 cm(2)/V-s. In addition, the uniformity of the device performance was improved as lateral growth could be artificially controlled. (C) 2004 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleHigh-performance poly-Si thin film transistors crystallized by excimer laser irradiation with a-Si spacer structureen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1830372en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume8en_US
dc.citation.issue1en_US
dc.citation.spageG14en_US
dc.citation.epageG16en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000228356800039-
dc.citation.woscount4-
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