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dc.contributor.authorHsu, Che-Weien_US
dc.contributor.authorCheng, Tsung-Chiehen_US
dc.contributor.authorYang, Chun-Huien_US
dc.contributor.authorShen, Yi-Lingen_US
dc.contributor.authorWu, Jong-Shinnen_US
dc.contributor.authorWu, Sheng-Yaoen_US
dc.date.accessioned2014-12-08T15:37:28Z-
dc.date.available2014-12-08T15:37:28Z-
dc.date.issued2011-02-03en_US
dc.identifier.issn0925-8388en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.jallcom.2010.10.037en_US
dc.identifier.urihttp://hdl.handle.net/11536/25774-
dc.description.abstractWe deposited a ZnO thin film on a microslide glass substrate at room temperature by employing the RF reactive magnetron sputtering process. Our results revealed that deposition rate decreases by increasing O(2)/(Ar + O(2)) ratio that was caused by two mechanisms. The first mechanism was the reduction of plasma density and, thus, argon ion density; caused by the addition of highly electronegative oxygen. While the second mechanism was target poisoning caused by the oxidation of the target. Additionally, at the O(2)/(Ar + O(2)) ratio of similar to 0.3 and the help of XPS analysis the optimum stoichiometry of ZnO thin film (the highest binding energy and content fraction of O(1) peak (O-Zn bond)) and the best polycrystallinity (the lowest FWHM with largest grain size) was found. (C) 2010 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectZinc oxideen_US
dc.subjectRadio frequencyen_US
dc.subjectSputteringen_US
dc.subjectTarget poisoningen_US
dc.subjectX-ray diffractionen_US
dc.subjectX-ray photoelectron spectroscopyen_US
dc.titleEffects of oxygen addition on physical properties of ZnO thin film grown by radio frequency reactive magnetron sputteringen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.jallcom.2010.10.037en_US
dc.identifier.journalJOURNAL OF ALLOYS AND COMPOUNDSen_US
dc.citation.volume509en_US
dc.citation.issue5en_US
dc.citation.spage1774en_US
dc.citation.epage1776en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000287167700087-
dc.citation.woscount17-
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