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dc.contributor.authorHsin, Cheng-Lunen_US
dc.contributor.authorWu, Wen-Weien_US
dc.contributor.authorChu, Li-Weien_US
dc.contributor.authorHsu, Hung-Changen_US
dc.contributor.authorChen, Lih-Juannen_US
dc.date.accessioned2014-12-08T15:37:47Z-
dc.date.available2014-12-08T15:37:47Z-
dc.date.issued2011en_US
dc.identifier.issn1466-8033en_US
dc.identifier.urihttp://hdl.handle.net/11536/25975-
dc.identifier.urihttp://dx.doi.org/10.1039/c1ce05329aen_US
dc.description.abstractA nanotemplate of Si bicrystal was fabricated by wafer bonding. The surface electronic energy arrangement on the surface of the Si bicrystal has been measured by scanning tunneling microscopy. The stress effect on the stepped growth of titanium silicide nanorods on Si bicrystal was observed in an ultrahigh vacuum transmission electron microscope in real time. The growth behavior of the nanorods was found to be affected by the underlying dislocation arrays significantly. For a dislocation interspacing of 3.1 nm, the dislocation arrays confined the shape of the nanoclusters and nanorods. Compared to the time of the nanorod remaining at the same length, the elongating time is more than two orders of magnitude shorter. The stepped growth behavior is attributed to the stress contour of the surface strain induced by the underlying dislocation network. This study is constructive to the basic understanding of the stress effect on the initial stage of the reaction of metals on Si and the observation may be applied to nanostructure growth for future applications and design.en_US
dc.language.isoen_USen_US
dc.titleControlled growth of the silicide nanostructures on Si bicrystal nanotemplate at a precision of a few nanometresen_US
dc.typeArticleen_US
dc.identifier.doi10.1039/c1ce05329aen_US
dc.identifier.journalCRYSTENGCOMMen_US
dc.citation.volume13en_US
dc.citation.issue12en_US
dc.citation.spage3967en_US
dc.citation.epage3970en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000291218500004-
dc.citation.woscount4-
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