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dc.contributor.authorRavipati, Srikanthen_US
dc.contributor.authorKuo, Chang-Jungen_US
dc.contributor.authorShieh, Jiannen_US
dc.contributor.authorChou, Cheng-Tungen_US
dc.contributor.authorKo, Fu-Hsiangen_US
dc.date.accessioned2014-12-08T15:38:26Z-
dc.date.available2014-12-08T15:38:26Z-
dc.date.issued2010-12-01en_US
dc.identifier.issn0026-2714en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.microrel.2010.06.005en_US
dc.identifier.urihttp://hdl.handle.net/11536/26313-
dc.description.abstractWe reported the fabrication and the field emission properties of two-tier novel silicon nanostructures. First, silicon nanopillars with ordered high aspect ratio were achieved by using conventional lithographic techniques to act as the field emission sources. Second, sharp-edged well-aligned silicon nanograss was fabricated on top of the nanopillars by means of hydrogen plasma dry etching to induce the field emission characteristics. The turn-on fields were obtained as 10.5 and 14.4 V/mu m under current density of 0.01 mA/cm(2) for two-tier patterns separated by respective 5 mu m and 2 mu m spaces. The excellent field emission property from these novel nanostructures exhibited a great potential as high-performance field emitter arrays towards future nanoelectronic devices. (C) 2010 Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleFabrication and enhanced field emission properties of novel silicon nanostructuresen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.microrel.2010.06.005en_US
dc.identifier.journalMICROELECTRONICS RELIABILITYen_US
dc.citation.volume50en_US
dc.citation.issue12en_US
dc.citation.spage1973en_US
dc.citation.epage1976en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department材料科學與工程學系奈米科技碩博班zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentGraduate Program of Nanotechnology , Department of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000285667300011-
dc.citation.woscount7-
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