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dc.contributor.authorHuang, KYen_US
dc.contributor.authorLi, YMen_US
dc.contributor.authorLee, CPen_US
dc.date.accessioned2014-12-08T15:38:43Z-
dc.date.available2014-12-08T15:38:43Z-
dc.date.issued2004-08-01en_US
dc.identifier.issn0167-9317en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.mee.2004.03.083en_US
dc.identifier.urihttp://hdl.handle.net/11536/26495-
dc.description.abstractIn this paper, we simulate the nonlinearity of a multifinger heterojunction bipolar transistor (HBT) operated at radio frequency (RF). We directly solve the nonlinear differential equations of the HBT large-signal model with the electrical-thermal feedback equations in time domain using the waveform relaxation (WR) and monotone iterative (MI) methods. The temperature dependence of energy band gap (E-g), current gain, saturation current and thermal conductivity are also taken into consideration. With the developed simulator, the power-added efficiency (PAE), 1-dB compression point (P1-dB) and output third-order intercept point (OIP3) of a three-finger HBT are calculated. Our results illustrate the effects of self-heating and thermal coupling among different fingers play important roles in the nonlinearity of the multifinger power transistors. Furthermore, the proposed method allows us to evaluate the thermal effects on linearity of the multifinger power transistors and perform optimum design for these devices. (C) 2004 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectnonlinearityen_US
dc.subjectself-heatingen_US
dc.subjectintermodulationen_US
dc.subjectdistortionen_US
dc.subjectmultifingeren_US
dc.subjectOIP3en_US
dc.subjectIIP3en_US
dc.subjectpower transistoren_US
dc.subjectthermalen_US
dc.subjectHBT modelen_US
dc.subjectsimulationen_US
dc.titleComputer simulation of multifinger heterojunction bipolar transistor with self-heating and thermal coupling modelsen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.mee.2004.03.083en_US
dc.identifier.journalMICROELECTRONIC ENGINEERINGen_US
dc.citation.volume75en_US
dc.citation.issue2en_US
dc.citation.spage137en_US
dc.citation.epage144en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department友訊交大聯合研發中心zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentD Link NCTU Joint Res Ctren_US
dc.identifier.wosnumberWOS:000223442000002-
dc.citation.woscount4-
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