Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Chiang, PC | en_US |
dc.contributor.author | Whang, WT | en_US |
dc.contributor.author | Wu, SC | en_US |
dc.contributor.author | Chuang, KR | en_US |
dc.date.accessioned | 2014-12-08T15:38:58Z | - |
dc.date.available | 2014-12-08T15:38:58Z | - |
dc.date.issued | 2004-06-03 | en_US |
dc.identifier.issn | 0032-3861 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1016/j.polymer.2004.04.024 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/26682 | - |
dc.description.abstract | Nano-titania (TiO2) incorporated into polyimide (PI) matrix can significantly enhance the adhesion strength for PI/TiO2 hybrid film and copper system. Surface modifications by various plasma treatments (Ar, Ar/N-2 and Ar/O-2) were also applied in this study to improve the adhesion strength. The Ar/N2 plasma treatment is regarded as the more effective way in promoting the adhesion strength. The maximum adhesion value of 9.53 N/cm was obtained for the PI/TiO2-1 wt% hybrid film with Ar/N-2 plasma treatment. It is enhanced about 10 times as large as pristine PI. Furthermore, by Ar/O-2 plasma treatment, a weak boundary of copper oxide was formed at the interlayer between PI/TiO2 hybrid film and copper which decreases the adhesion strength. The effects of plasma treatment and content of nanosized TiO2 on the adhesion strength between PI/TiO2 hybrid film and copper system were studied. Atomic force microscope and contact angle analyses were used to measure the changes in surface morphology and surface energy as a result of plasma treatment. Besides, the interfacial states of peeled-off polymer side and copper side were investigated by X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). Based on the result of XPS spectra, the peeled-off failure mode between PI/TiO2 hybrid film and copper was proposed in this study. (C) 2004 Elsevier Ltd. All rights reserved. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | polyimide | en_US |
dc.subject | Titania | en_US |
dc.subject | plasma treatment | en_US |
dc.title | Effects of titania content and plasma treatment on the interfacial adhesion mechanism of nano titania-hybridized polyimide and copper system | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1016/j.polymer.2004.04.024 | en_US |
dc.identifier.journal | POLYMER | en_US |
dc.citation.volume | 45 | en_US |
dc.citation.issue | 13 | en_US |
dc.citation.spage | 4465 | en_US |
dc.citation.epage | 4472 | en_US |
dc.contributor.department | 材料科學與工程學系 | zh_TW |
dc.contributor.department | Department of Materials Science and Engineering | en_US |
dc.identifier.wosnumber | WOS:000221836600013 | - |
dc.citation.woscount | 14 | - |
Appears in Collections: | Articles |
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