Reduced copper diffusion in layered silicate/fluorinated polyimide (6FDA-ODA) nanocomposites

doi:10.1002/app.13676

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DC 欄位	值	語言
dc.contributor.author	Jiang, LY	en_US
dc.contributor.author	Wei, KH	en_US
dc.date.accessioned	2014-12-08T15:39:12Z	-
dc.date.available	2014-12-08T15:39:12Z	-
dc.date.issued	2004-05-05	en_US
dc.identifier.issn	0021-8995	en_US
dc.identifier.uri	http://dx.doi.org/10.1002/app.13676	en_US
dc.identifier.uri	http://hdl.handle.net/11536/26786	-
dc.description.abstract	The copper diffusion barrier properties of layered silicate/fluorinated polyimide nanocomposites were analyzed by transmission electron microscopy (TEM) and secondary ion mass spectrometry (SIMS). It was found that the particles of copper are effectively retarded from penetrating into the polyimide matrix by layered silicates. The diffusion coefficients of layered silicate/polyimide nanocomposites are lower than that of the pure polyimide. (C) 2004 Wiley Periodicals, Inc.	en_US
dc.language.iso	en_US	en_US
dc.subject	copper diffusion	en_US
dc.subject	layered silicates	en_US
dc.subject	fluorinated polyimide	en_US
dc.subject	nanocomposites	en_US
dc.title	Reduced copper diffusion in layered silicate/fluorinated polyimide (6FDA-ODA) nanocomposites	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1002/app.13676	en_US
dc.identifier.journal	JOURNAL OF APPLIED POLYMER SCIENCE	en_US
dc.citation.volume	92	en_US
dc.citation.issue	3	en_US
dc.citation.spage	1422	en_US
dc.citation.epage	1425	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000220435000006	-
dc.citation.woscount	1	-
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