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dc.contributor.authorZous, NKen_US
dc.contributor.authorChen, YJen_US
dc.contributor.authorChin, CYen_US
dc.contributor.authorTsai, WJen_US
dc.contributor.authorLu, TCen_US
dc.contributor.authorChen, MSen_US
dc.contributor.authorLu, WPen_US
dc.contributor.authorWang, THen_US
dc.contributor.authorPan, SCen_US
dc.contributor.authorLu, CYen_US
dc.date.accessioned2014-12-08T15:39:14Z-
dc.date.available2014-12-08T15:39:14Z-
dc.date.issued2004-05-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2004.826871en_US
dc.identifier.urihttp://hdl.handle.net/11536/26800-
dc.description.abstractTrap generation is hard to estimate in a Flash cell due to a dynamic stress field during program and erase. In this paper, a linear correlation is found between the erase state V-T rollup, and cycling V-T window. With the knowledge of the time dependence of erase stress field based on Fowler-Nordheim (FN) tunneling, the V-T rollup during cycling is evaluated by incorporating field dependent oxide trap generation. The extracted Delta V-T degradation slope during constant FN stress can be applied quantitatively to predict the V-T window closure during Flash cell cycling.en_US
dc.language.isoen_USen_US
dc.subjectdynamic stressen_US
dc.subjectevaluation methoden_US
dc.subjectFlash EEPROMen_US
dc.subjecttunnel oxideen_US
dc.titleAn endurance evaluation method for flash EEPROMen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2004.826871en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume51en_US
dc.citation.issue5en_US
dc.citation.spage720en_US
dc.citation.epage725en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000221117300011-
dc.citation.woscount2-
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