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dc.contributor.authorChang, YWen_US
dc.contributor.authorLin, SPen_US
dc.date.accessioned2014-12-08T15:39:16Z-
dc.date.available2014-12-08T15:39:16Z-
dc.date.issued2004-05-01en_US
dc.identifier.issn0278-0070en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TCAD.2004.826547en_US
dc.identifier.urihttp://hdl.handle.net/11536/26818-
dc.description.abstractIn this paper, we propose a novel framework for multilevel full-chip routing considering both routability and performance called MR. The two-stage multilevel framework consists of coarsening, followed by uncoarsening. Unlike the previous multilevel routing, MR integrates global routing, detailed routing, and resource estimation, together at each level of the framework, leading to more accurate routing resource estimation during coarsening and thus facilitating the solution refinement during uncoarsening. Further, the exact routing information obtained at each level makes MR more flexible in dealing with various routing objectives (such as crosstalk, power, etc.). Experimental results show that MR obtains significantly better routing solutions than previous works. For example, for a set of 11 commonly used benchmark circuits, MR achieves 100% routing completion for all circuits, while the previous multilevel routing, the three-level routing, and the hierarchical routing can complete routing for only 2, 0, 2 circuits, respectively. In particular, the number of routing layers used by MR is even smaller. We also have performed experiments on timing-driven routing. The results are also very promising.en_US
dc.language.isoen_USen_US
dc.subjectdetailed routingen_US
dc.subjectestimationen_US
dc.subjectglobal routingen_US
dc.subjectlayouten_US
dc.subjectphysical designen_US
dc.subjectroutingen_US
dc.subjecttiming optimizationen_US
dc.titleMR: A new framework for multilevel full-chip routingen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1109/TCAD.2004.826547en_US
dc.identifier.journalIEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMSen_US
dc.citation.volume23en_US
dc.citation.issue5en_US
dc.citation.spage793en_US
dc.citation.epage800en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000221216000015-
Appears in Collections:Conferences Paper


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