統計資料
總造訪次數
| 檢視 | |
|---|---|
| Abnormal ESD failure mechanism in high-pin-count BGA packaged ICs due to stressing nonconnected balls | 114 |
本月總瀏覽
| 五月 2024 | 六月 2024 | 七月 2024 | 八月 2024 | 九月 2024 | 十月 2024 | 十一月 2024 | |
|---|---|---|---|---|---|---|---|
| Abnormal ESD failure mechanism in high-pin-count BGA packaged ICs due to stressing nonconnected balls | 0 | 1 | 0 | 0 | 0 | 0 | 0 |
檔案下載
| 檢視 | |
|---|---|
| 000220708500005.pdf | 8 |
國家瀏覽排行
| 檢視 | |
|---|---|
| 中國 | 99 |
| 美國 | 14 |
縣市瀏覽排行
| 檢視 | |
|---|---|
| Shenzhen | 95 |
| Menlo Park | 7 |
| Kensington | 6 |
| Zhengzhou | 3 |
| Beijing | 1 |
| Edmond | 1 |