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dc.contributor.authorWu, Jen_US
dc.contributor.authorWang, YLen_US
dc.contributor.authorLiu, CPen_US
dc.contributor.authorChang, SCen_US
dc.contributor.authorKuo, CTen_US
dc.contributor.authorAy, Cen_US
dc.date.accessioned2014-12-08T15:39:43Z-
dc.date.available2014-12-08T15:39:43Z-
dc.date.issued2004-01-30en_US
dc.identifier.issn0040-6090en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.tsf.2003.07.029en_US
dc.identifier.urihttp://hdl.handle.net/11536/27118-
dc.description.abstractPrecipitation on fluorine-doped silicon oxide film (SiOF) was observed while exposure to air for a prolonged period of time (>4 h). Most of the precipitates are less than 1 mum and clustered at wafer center. Under SEM view, the precipitation shows hexagonal shape, and mainly composed of Si and O. SIMS analysis showed that SiOF films without F precipitates showed leveling F% profile, whereas SIMS result for SiOF films with precipitations shows increasing gradient with depth. In this study, factors affecting the precipitation of SiOF film were investigated. Humidity in environment was found to be one of the essential elements for the onset of precipitation. Process optimization and control methodologies were also investigated for precipitation prevention to provide a more robust and stable SiOF film, hence ensuring the reliability of device performance. (C) 2003 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectfluorine-doped silicon oxideen_US
dc.subjectprecipitationsen_US
dc.titleStudy on precipitations of fluorine-doped silicon oxideen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/j.tsf.2003.07.029en_US
dc.identifier.journalTHIN SOLID FILMSen_US
dc.citation.volume447en_US
dc.citation.issueen_US
dc.citation.spage599en_US
dc.citation.epage604en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000188995700103-
Appears in Collections:Conferences Paper


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