完整後設資料紀錄
DC 欄位語言
dc.contributor.authorWang, YKen_US
dc.contributor.authorTseng, TYen_US
dc.contributor.authorLin, Pen_US
dc.date.accessioned2014-12-08T15:39:45Z-
dc.date.available2014-12-08T15:39:45Z-
dc.date.issued2004-01-01en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1626991en_US
dc.identifier.urihttp://hdl.handle.net/11536/27146-
dc.description.abstractFerroelectric Pb(Zr0.53Ti0.47)O-3 (PZT) thin films were deposited on BaRuO3 (BRO)/Ru/SiO2/Si substrates by a sol-gel method. The (110)-oriented BaRuO3 bottom electrode films were deposited by rf sputtering at various temperatures. Highly (110) preferentially oriented PZT films were formed after annealing at over 450degreesC. The leakage current, dielectric constant, loss tangent, and polarization vs. electric field properties were strongly dependent on the annealing temperature of the PZT films and the deposition temperature of BRO electrodes. The dielectric constant and polarization decreased when the annealing temperature of the PZT film was over 700degreesC, which may be due to the interdiffusion between PZT and BRO. (C) 2003 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titlePreferentially oriented ferroelectric Pb(Zr0.53Ti0.47)O(3)thin films on (110)BaRuO3/Ru/SiO2/Si substratesen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1626991en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume7en_US
dc.citation.issue1en_US
dc.citation.spageF1en_US
dc.citation.epageF3en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000186902300016-
dc.citation.woscount1-
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