完整後設資料紀錄
DC 欄位語言
dc.contributor.authorWU, JSen_US
dc.contributor.authorLEE, MJen_US
dc.date.accessioned2014-12-08T15:04:14Z-
dc.date.available2014-12-08T15:04:14Z-
dc.date.issued1994en_US
dc.identifier.issn0959-8111en_US
dc.identifier.urihttp://hdl.handle.net/11536/2727-
dc.description.abstractStudies involving the structure of the parts molded from the low pressure structural foam injection molding (LPSF) and the gas counter pressure structural foam injection molding (CPSF) were conducted via varying processing conditions. The bubbles near the skin layer were observed to be less uniform in size and more elongated for the LPSF parts than for the CPSF parts. The CPSF parts, however, exhibited a more uniform cellar core. The skin layer thickness from both processes increased under one of the following conditions: higher melt temperature, higher reduced density, lower injection speed, or lower blowing agent concentration. As regards the effect of mold temperature, a higher mold temperature resulted in an increase of the skin layer thickness for the LPSF parts but a decrease for the CPSF parts. The skin layer of the CPSF part would, become thin if the gas counter pressure was not high enough to prevent foaming during melt injection. With a sufficient amount of gas counter pressure, the CPSF parts were observed under the same processing conditions to become superior to the corresponding LPSF parts owing to a thicker skin layer with a greater integrity and smoother surface.en_US
dc.language.isoen_USen_US
dc.titleSTUDIES ON GAS COUNTER PRESSURE AND LOW-PRESSURE STRUCTURAL FOAM MOLDING .2. EFFECT OF PROCESSING CONDITIONS ON STRUCTURE OF MOLDED PARTSen_US
dc.typeArticleen_US
dc.identifier.journalPLASTICS RUBBER AND COMPOSITES PROCESSING AND APPLICATIONSen_US
dc.citation.volume21en_US
dc.citation.issue3en_US
dc.citation.spage173en_US
dc.citation.epage182en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department應用化學系zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.identifier.wosnumberWOS:A1994NC55400005-
dc.citation.woscount1-
顯示於類別:期刊論文