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dc.contributor.authorLin, Chin-Chingen_US
dc.contributor.authorChiang, Mei-Chingen_US
dc.contributor.authorChen, Yu-Weien_US
dc.date.accessioned2014-12-08T15:39:57Z-
dc.date.available2014-12-08T15:39:57Z-
dc.date.issued2009-12-15en_US
dc.identifier.issn0040-6090en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.tsf.2009.05.064en_US
dc.identifier.urihttp://hdl.handle.net/11536/27299-
dc.description.abstractFluorine-doped tin oxide (FTO) films were prepared at different substrate temperatures by ultrasonic spray pyrolysis technique on glass substrates. Among F-doped tin oxide films, the lowest resistivitiy was found to be 6.2 x 10(-4) Omega-cm for a doping percentage of 50 mol% of fluorine in 0.5 M solution, deposited at 400 degrees C. Hall coefficient analyses and secondary ion mass spectrometry (SIMS) measured the electron carrier concentration that varies from 3.52 x 10(20) cm(-3) to 6.21 x 10(20) cm(-3) with increasing fluorine content from 4.6 x 10(20) cm(-3) to 7.2 x 10(20) cm(-3) in FTO films deposited on various temperatures. Deposition temperature on FTO films has been optimized for achieving a minimum resistivity and maximum optical transmittance. (C) 2009 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectFluorine dopingen_US
dc.subjectFluorine concentrationen_US
dc.subjectTin oxideen_US
dc.subjectSpray pyrolysisen_US
dc.subjectSIMSen_US
dc.titleTemperature dependence of Fluorine-doped tin oxide films produced by ultrasonic spray pyrolysisen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/j.tsf.2009.05.064en_US
dc.identifier.journalTHIN SOLID FILMSen_US
dc.citation.volume518en_US
dc.citation.issue4en_US
dc.citation.spage1241en_US
dc.citation.epage1244en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000272733200050-
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