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dc.contributor.authorLin, TCen_US
dc.contributor.authorWu, JCen_US
dc.date.accessioned2014-12-08T15:40:07Z-
dc.date.available2014-12-08T15:40:07Z-
dc.date.issued2003-11-01en_US
dc.identifier.issn0916-8524en_US
dc.identifier.urihttp://hdl.handle.net/11536/27395-
dc.description.abstractThis paper describes the robust design of the 30 V high voltage NMOS (HVNMOS) structure implemented in a 0.6 mum 5 V standard CMOS processes without any additional masks or process steps. The structure makes use of the field oxide (FOX) and light doping N-well to increase the drain to gate and drain to bulk breakdown voltages, respectively. By varying the six spacing parameters: the channel length, gate overlap FOX, N-well overlap channel length, poly to the active area of the drain (OD2), metal extend beyond the OD2 and N-well extend beyond the OD2 in HVNMOS structure. the breakdown voltage can be improved. The experimental results show that the breakdown voltage of the normal NMOS is 11V, and the breakdown voltage of the HVNMOS is increased to over 30 V. With the optimized layout parameters of the HVNMOS, it can be increased to 38 V.en_US
dc.language.isoen_USen_US
dc.subjectstandard CMOS processesen_US
dc.subjecthigh voltage NMOSen_US
dc.subjectbreakdown voltageen_US
dc.titleA 30 V high voltage NMOS structure design in standard 5 VCMOS processesen_US
dc.typeArticleen_US
dc.identifier.journalIEICE TRANSACTIONS ON ELECTRONICSen_US
dc.citation.volumeE86Cen_US
dc.citation.issue11en_US
dc.citation.spage2341en_US
dc.citation.epage2345en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000186434500030-
dc.citation.woscount0-
Appears in Collections:Articles