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dc.contributor.authorChan, KTen_US
dc.contributor.authorChin, Aen_US
dc.contributor.authorLin, YDen_US
dc.contributor.authorChang, CYen_US
dc.contributor.authorZhu, CXen_US
dc.contributor.authorLi, MFen_US
dc.contributor.authorKwong, DLen_US
dc.contributor.authorMcAlister, Sen_US
dc.contributor.authorDuh, DSen_US
dc.contributor.authorLin, WJen_US
dc.date.accessioned2014-12-08T15:40:09Z-
dc.date.available2014-12-08T15:40:09Z-
dc.date.issued2003-11-01en_US
dc.identifier.issn1531-1309en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LMWC.2003.817146en_US
dc.identifier.urihttp://hdl.handle.net/11536/27427-
dc.description.abstractWe have improved the performance of integrated antennas on Si for possible application in wireless communications and wireless interconnects. For practical VLSI integration, we have reduced the antenna size and optimized the proton implantation to a low energy of similar to 4 MeV with a depth of similar to 175 mum. To avoid any possible contamination, the ion implantation is applied after device fabrication. Excellent performance such as very low RF power loss up to 50 GHz, record high 103 GHz antenna resonance, and sharp 5 GHz bandwidth have been achieved.en_US
dc.language.isoen_USen_US
dc.subjectantennaen_US
dc.subjectimplantationen_US
dc.subjectlossen_US
dc.subjectRFen_US
dc.subjecttransmission lineen_US
dc.titleIntegrated antennas on Si with over 100 GHz performance, fabricated using an optimized proton implantation processen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LMWC.2003.817146en_US
dc.identifier.journalIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERSen_US
dc.citation.volume13en_US
dc.citation.issue11en_US
dc.citation.spage487en_US
dc.citation.epage489en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000186401900011-
dc.citation.woscount26-
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