標題: | Etching damages on AlGaN, GaN and InGaN caused by hybrid inductively coupled plasma etch and photoenhanced chemical wet etch by Schottky contact characterizations |
作者: | Fang, CY Huang, WJ Chang, EY Lin, CF Feng, MS 材料科學與工程學系 光電工程學系 Department of Materials Science and Engineering Department of Photonics |
關鍵字: | AlGaN;GaN;InGaN;hybrid etch;inductively coupled plasma;photoenhanced chemical etch;Schottky diode;dry etch;etch;ICP;PEC |
公開日期: | 1-七月-2003 |
摘要: | The surface damaging effects of the inductively coupled plasma (ICP) etch and the photoenhanced chemical (PEC) wet etch on AlGaN, GaN and InGaN were systematically investigated. The surface morphologies and the etch rates after ICP etch and PEC wet etch were explored to achieve optimum conditions for a hybrid etch technique. The etch rates increased with the ICP power or concentration of KOH(aq) and the surface roughness was less after PEC wet etch than it was after ICP etch. Schottky characterizations of GaN and AlGaN diodes after pure ICP etch, pure PEC etch and hybrid ICP/PEC etch were investigated to elucidate the damaging effects on the surfaces. It shows that the PEC etch is an effective way to achieve a damage-free surface for GaN-based materials, and the hybrid ICP/PEC etch can be used for applications which require high etch rate and damage-free surfaces. |
URI: | http://dx.doi.org/10.1143/JJAP.42.4207 http://hdl.handle.net/11536/27729 |
ISSN: | 0021-4922 |
DOI: | 10.1143/JJAP.42.4207 |
期刊: | JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS |
Volume: | 42 |
Issue: | 7A |
起始頁: | 4207 |
結束頁: | 4212 |
顯示於類別: | 期刊論文 |