完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Jian, SR | en_US |
dc.contributor.author | Fang, TH | en_US |
dc.contributor.author | Chuu, DS | en_US |
dc.date.accessioned | 2014-12-08T15:40:48Z | - |
dc.date.available | 2014-12-08T15:40:48Z | - |
dc.date.issued | 2003-06-01 | en_US |
dc.identifier.issn | 0361-5235 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/27821 | - |
dc.description.abstract | The thin films of undoped GaN, GaN:Si, and Al0.12Ga0.88N on sapphire (0001) substrate using nanoindentation are investigated. The Young's modulus, hardness, and plastic energy of the films were calculated from the loading-unloading curve. The true hardness, maximum shear stress, and degree of elastic recovery are then deduced from the preceding calculated data. In addition, the loading-unloading curve clearly shows the pop-in phenomena, which can be attributed to the dislocation nucleation. To better understand the factors affecting the quality of films produced, the stress-strain relationship, which is able to reflect the quality of the fabricated films, is also analyzed using nanoindentation. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | nanoindentation | en_US |
dc.subject | Young's modulus | en_US |
dc.subject | hardness | en_US |
dc.subject | maximum shear stress | en_US |
dc.subject | plastic energy | en_US |
dc.subject | elastic recovery | en_US |
dc.subject | contact stress-strain | en_US |
dc.title | Analysis of physical properties of III-nitride thin films by nanoindentation | en_US |
dc.type | Article | en_US |
dc.identifier.journal | JOURNAL OF ELECTRONIC MATERIALS | en_US |
dc.citation.volume | 32 | en_US |
dc.citation.issue | 6 | en_US |
dc.citation.spage | 496 | en_US |
dc.citation.epage | 500 | en_US |
dc.contributor.department | 電子物理學系 | zh_TW |
dc.contributor.department | Department of Electrophysics | en_US |
dc.identifier.wosnumber | WOS:000183490500005 | - |
dc.citation.woscount | 33 | - |
顯示於類別: | 期刊論文 |