完整後設資料紀錄
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dc.contributor.authorLee, TLen_US
dc.contributor.authorLee, JWen_US
dc.contributor.authorLee, MCen_US
dc.contributor.authorLei, TFen_US
dc.contributor.authorLee, CLen_US
dc.date.accessioned2014-12-08T15:41:01Z-
dc.date.available2014-12-08T15:41:01Z-
dc.date.issued2003-05-01en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1563093en_US
dc.identifier.urihttp://hdl.handle.net/11536/27935-
dc.description.abstractZr is proposed to be the capping layer for nickel silicide to obtain a stable low resistance contact system even at an annealing temperature as high as 850degreesC. A NiSi monolayer is the only phase observed in those samples annealed from 500 to 850degreesC. Experimental results from transmission electron microscopy and X-ray diffractometry analysis show that the agglomeration and precipitate of nickel silicide problems which are usually encountered in the NiSi system are eliminated. (C) 2003 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleHighly reliable nickel silicide formation with a Zr capping layeren_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1563093en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume6en_US
dc.citation.issue5en_US
dc.citation.spageG66en_US
dc.citation.epageG68en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000181766400015-
dc.citation.woscount9-
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