完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lee, TL | en_US |
dc.contributor.author | Lee, JW | en_US |
dc.contributor.author | Lee, MC | en_US |
dc.contributor.author | Lei, TF | en_US |
dc.contributor.author | Lee, CL | en_US |
dc.date.accessioned | 2014-12-08T15:41:01Z | - |
dc.date.available | 2014-12-08T15:41:01Z | - |
dc.date.issued | 2003-05-01 | en_US |
dc.identifier.issn | 1099-0062 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1149/1.1563093 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/27935 | - |
dc.description.abstract | Zr is proposed to be the capping layer for nickel silicide to obtain a stable low resistance contact system even at an annealing temperature as high as 850degreesC. A NiSi monolayer is the only phase observed in those samples annealed from 500 to 850degreesC. Experimental results from transmission electron microscopy and X-ray diffractometry analysis show that the agglomeration and precipitate of nickel silicide problems which are usually encountered in the NiSi system are eliminated. (C) 2003 The Electrochemical Society. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Highly reliable nickel silicide formation with a Zr capping layer | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1149/1.1563093 | en_US |
dc.identifier.journal | ELECTROCHEMICAL AND SOLID STATE LETTERS | en_US |
dc.citation.volume | 6 | en_US |
dc.citation.issue | 5 | en_US |
dc.citation.spage | G66 | en_US |
dc.citation.epage | G68 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000181766400015 | - |
dc.citation.woscount | 9 | - |
顯示於類別: | 期刊論文 |