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dc.contributor.authorChang, TCen_US
dc.contributor.authorChen, CWen_US
dc.contributor.authorLiu, PTen_US
dc.contributor.authorMor, YSen_US
dc.contributor.authorTsai, HMen_US
dc.contributor.authorTsai, TMen_US
dc.contributor.authorYan, STen_US
dc.contributor.authorTu, CHen_US
dc.contributor.authorTseng, TYen_US
dc.contributor.authorSze, SMen_US
dc.date.accessioned2014-12-08T15:41:07Z-
dc.date.available2014-12-08T15:41:07Z-
dc.date.issued2003-04-01en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1557032en_US
dc.identifier.urihttp://hdl.handle.net/11536/27974-
dc.description.abstractThe mechanism of leakage current of porous organosilicate glass (POSG) with O-2 plasma ashing is investigated. The O-2 plasma ashing often deteriorates the POSG film, causing moisture uptake. We find that the leakage-current mechanism of POSG transforms from Schottky emission into ionic conduction after O-2 plasma treatment. The mobile ions (H+,OH-) supported by absorbing moisture move easily when an external electric field is applied to POSG film, which leads to the ionic conduction leakage current across the moisture-absorbing POSG film. Hence, the leakage current density is drastically increased about four to five orders of magnitude compared with untreated POSG film. (C) 2003 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleMoisture-induced material instability of porous organosilicate glassen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1557032en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume6en_US
dc.citation.issue4en_US
dc.citation.spageF13en_US
dc.citation.epageF15en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000181148900011-
dc.citation.woscount14-
Appears in Collections:Articles