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dc.contributor.authorYeh, KLen_US
dc.contributor.authorLin, HCen_US
dc.contributor.authorTsai, RWen_US
dc.contributor.authorLee, MHen_US
dc.contributor.authorHuang, TYen_US
dc.date.accessioned2014-12-08T15:41:10Z-
dc.date.available2014-12-08T15:41:10Z-
dc.date.issued2003-04-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.42.2127en_US
dc.identifier.urihttp://hdl.handle.net/11536/28018-
dc.description.abstractSchottky barrier thin-film transistors (SB TFT) with field-induced drain (FID) have recently been demonstrated to exhibit ambipolar capability with low off-state leakage current. In this study, we investigate and compare the characteristics of poly-Si SB TFTs with channel layer prepared by excimer laser crystallization (ELC) and solid-phase crystallization (SPC). It is shown that the use of ELC could greatly improve the device characteristics, comparing to the SPC counterparts. Excellent device performance with steep subthreshold slope and on/off current ratio higher than 10(8) for both p- and n-channel operations are demonstrated on a single device with ELC channel. The effects of sub-gate bias, channel length, and channel offset length, on device characteristics are also explored.en_US
dc.language.isoen_USen_US
dc.subjectSchottky barrieren_US
dc.subjectthin-film transistoren_US
dc.subjectfield-induced drain (FID)en_US
dc.subjectfield emissionen_US
dc.titleFabrication and characterization of Schottky barrier polysilicon thin-film transistors with excimer-laser crystallized channelen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1143/JJAP.42.2127en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERSen_US
dc.citation.volume42en_US
dc.citation.issue4Ben_US
dc.citation.spage2127en_US
dc.citation.epage2131en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000183283700065-
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