統計資料
總造訪次數
| 檢視 | |
|---|---|
| Effects of Ni thickness and reflow times on interfacial reactions between Ni/Cu under-bump metallization and eutectic Sn-Pb solder in flip-chip technology | 112 |
本月總瀏覽
| 六月 2025 | 七月 2025 | 八月 2025 | 九月 2025 | 十月 2025 | 十一月 2025 | 十二月 2025 | |
|---|---|---|---|---|---|---|---|
| Effects of Ni thickness and reflow times on interfacial reactions between Ni/Cu under-bump metallization and eutectic Sn-Pb solder in flip-chip technology | 0 | 0 | 0 | 2 | 0 | 2 | 2 |
檔案下載
| 檢視 | |
|---|---|
| 000180869100007.pdf | 14 |
國家瀏覽排行
| 檢視 | |
|---|---|
| 中國 | 96 |
| 美國 | 12 |
| 厄瓜多爾 | 1 |
| 越南 | 1 |
縣市瀏覽排行
| 檢視 | |
|---|---|
| Shenzhen | 96 |
| Menlo Park | 4 |
| Buffalo | 2 |
| Edmond | 2 |
| Kensington | 2 |
| Hanoi | 1 |
| Quito | 1 |
| University Park | 1 |