完整後設資料紀錄
DC 欄位語言
dc.contributor.authorFang, THen_US
dc.contributor.authorJian, SRen_US
dc.contributor.authorChuu, DSen_US
dc.date.accessioned2014-12-08T15:41:45Z-
dc.date.available2014-12-08T15:41:45Z-
dc.date.issued2002-11-15en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.41.L1328en_US
dc.identifier.urihttp://hdl.handle.net/11536/28383-
dc.description.abstractThree-dimensional molecular dynamics (MD) simulation is used to investigate the atomistic mechanism of nanoindentation process under various indentation loads and velocities that occur when a diamond tip interacts with the copper thin film. In this study, the model utilizes the Morse potential function to simulate interatomic forces between the specimen and tip. The results show that both Young's modulus and hardness increase up to a critical value and decrease there after for the indentation velocities, but decrease as the indentation loads increase. In additional, the contact stress-strain relationship is shown to be important.en_US
dc.language.isoen_USen_US
dc.subjectmolecular dynamicsen_US
dc.subjectnanoindentationen_US
dc.subjectYoung's modulusen_US
dc.subjecthardnessen_US
dc.subjectcontact stress strainen_US
dc.titleMolecular dynamics analysis of effects of velocity and loading on the nanoindentationen_US
dc.typeArticleen_US
dc.identifier.doi10.1143/JJAP.41.L1328en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERSen_US
dc.citation.volume41en_US
dc.citation.issue11Ben_US
dc.citation.spageL1328en_US
dc.citation.epageL1331en_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:000182826200017-
dc.citation.woscount4-
顯示於類別:期刊論文


文件中的檔案:

  1. 000182826200017.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。