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dc.contributor.authorYEH, CFen_US
dc.contributor.authorYANG, TZen_US
dc.contributor.authorCHEN, CLen_US
dc.contributor.authorCHEN, TJen_US
dc.contributor.authorYANG, YCen_US
dc.date.accessioned2014-12-08T15:04:20Z-
dc.date.available2014-12-08T15:04:20Z-
dc.date.issued1993-10-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://hdl.handle.net/11536/2840-
dc.description.abstractPoly-Si thin-film transistors (TFT's) have a large off -state current that is unacceptable for pixel river application. To quickly establish an effective solution to reduce the off-state current, systematic comparison and clarification of the mechanisms of off-state current are still insufficient. We will concentrate on an experimental comparison of off -state current mechanisms between low-temperature-processed (LTP) and high-temperature-processed (HTP) poly-Si TFT devices. Since all the off-state currents are found to be divided into three regions in LTP and HTP poly-Si TFT's, they are attributable to a resistive current in region I (low gate bias), pure thermal generation in region II (low drain bias) and Frenkel-Poole emission in region III (high gate bias, drain bias).en_US
dc.language.isoen_USen_US
dc.subjectPOLYCRYSTALLINEen_US
dc.subjectSILICONen_US
dc.subjectTFTen_US
dc.subjectLEAKAGE CURRENTen_US
dc.subjectCONDUCTION MECHANISMen_US
dc.titleEXPERIMENTAL COMPARISON OF OFF-STATE CURRENT BETWEEN HIGH-TEMPERATURE-PROCESSED AND LOW-TEMPERATURE-PROCESSED UNDOPED CHANNEL POLYSILICON THIN-FILM TRANSISTORSen_US
dc.typeArticleen_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERSen_US
dc.citation.volume32en_US
dc.citation.issue10en_US
dc.citation.spage4472en_US
dc.citation.epage4478en_US
dc.contributor.department電控工程研究所zh_TW
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.identifier.wosnumberWOS:A1993MQ76000016-
dc.citation.woscount9-
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