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dc.contributor.authorChang, MNen_US
dc.contributor.authorChen, CYen_US
dc.contributor.authorPan, FMen_US
dc.contributor.authorChang, TYen_US
dc.contributor.authorLei, TFen_US
dc.date.accessioned2014-12-08T15:42:06Z-
dc.date.available2014-12-08T15:42:06Z-
dc.date.issued2002-08-01en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1486820en_US
dc.identifier.urihttp://hdl.handle.net/11536/28600-
dc.description.abstractScanning capacitance microscopy (SCM) is employed to study defect distribution induced by iron contamination on p-type silicon wafers. For slightly contaminated samples, SCM reveals that iron contamination induces interface traps in the defect region. Interface traps perturb significantly the depletion behavior of the silicon surface. Iron contamination also decreases the lifetime and increases the density of minority carriers in the defect region. The defects induced by iron contamination exhibit an obvious bias-dependent SCM contrast. By differential capacitance images, one can examine the defect density distribution. The influence of these microscale defects on the electrical characteristics of the metal oxide semiconductor (MOS) capacitor cannot be observed by conventional capacitance-voltage measurement. (C) 2002 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleObservation of differential capacitance images on slightly iron-contaminated p-type siliconen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1486820en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume5en_US
dc.citation.issue8en_US
dc.citation.spageG69en_US
dc.citation.epageG71en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000176562400012-
dc.citation.woscount7-
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