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dc.contributor.authorWen, TCen_US
dc.contributor.authorLee, WIen_US
dc.contributor.authorSheu, JKen_US
dc.contributor.authorChi, GCen_US
dc.date.accessioned2014-12-08T15:42:33Z-
dc.date.available2014-12-08T15:42:33Z-
dc.date.issued2002-04-01en_US
dc.identifier.issn0038-1101en_US
dc.identifier.urihttp://dx.doi.org/10.1016/S0038-1101(01)00256-8en_US
dc.identifier.urihttp://hdl.handle.net/11536/28888-
dc.description.abstractThis work investigates dislocation etch pits in epitaxial lateral overgrowth (ELO) GaN by wet etching. A mixture of H2SO4 and H3PO4 was used as an etching solution. SEM and AFM were employed to observe the surface topography. For the as-grown sample, SEM images show the flat, smooth surface without any pits or hillocks. After the chemical etching, hexagonal shaped etch pits were observed at the edge of ELO GaN. AFM observation of etched ELO GaN displayed high densities of etch pits clustered in the "window" region and the coalescent line of two growing fronts. In contrast, the overgrowth region was nearly free of etch pits. Moreover, we observed that different sizes of etch pits dominated in "window" region and coalescent region. This implied different types dislocations dominated in these regions. (C) 2002 Elsevier Science Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleObservation of dislocation etch pits in epitaxial lateral overgrowth GaN by wet etchingen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/S0038-1101(01)00256-8en_US
dc.identifier.journalSOLID-STATE ELECTRONICSen_US
dc.citation.volume46en_US
dc.citation.issue4en_US
dc.citation.spage555en_US
dc.citation.epage558en_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.department資訊工程學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.contributor.departmentDepartment of Computer Scienceen_US
dc.identifier.wosnumberWOS:000175546200015-
dc.citation.woscount16-
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