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dc.contributor.authorLee, WHen_US
dc.contributor.authorLin, JCen_US
dc.contributor.authorLee, Cen_US
dc.contributor.authorCheng, HCen_US
dc.contributor.authorYew, TRen_US
dc.date.accessioned2014-12-08T15:42:47Z-
dc.date.available2014-12-08T15:42:47Z-
dc.date.issued2002-02-22en_US
dc.identifier.issn0040-6090en_US
dc.identifier.urihttp://dx.doi.org/10.1016/S0040-6090(01)01723-0en_US
dc.identifier.urihttp://hdl.handle.net/11536/29008-
dc.description.abstractThe effects of CH4/SiH4 flow ratio and microwave power on the formation of SiC at 200 degreesC by electron cyclotron resonance chemical vapor deposition is investigated. When the CH4/SiH4 flow ratio is varied from 0.5 to 10, crystalline phase of films vary from polycrystalline silicon to polycrystalline P-SiC and finally to amorphous silicon carbide. However, as the microwave power increases from 300 to 1500 W. the film microstructure changes from polycrystalline Si to amorphous SiC. and finally to polycrystalline beta-SiC. The deposition mechanism which controls the film characteristics is also presented. (C) 2002 Elsevier Science B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectchemical vapor depositionen_US
dc.subjectcyclotron resonance studiesen_US
dc.subjectsilicon carbideen_US
dc.subjecttransmission electron microscopyen_US
dc.titleEffects of CH4/SiH4 flow ratio and microwave power on the growth of beta-SiC on Si by ECR-CVD using CH4/SiH4/Ar at 200 degrees Cen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/S0040-6090(01)01723-0en_US
dc.identifier.journalTHIN SOLID FILMSen_US
dc.citation.volume405en_US
dc.citation.issue1-2en_US
dc.citation.spage17en_US
dc.citation.epage22en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000174418600003-
dc.citation.woscount5-
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