完整後設資料紀錄
DC 欄位語言
dc.contributor.authorYang, MJen_US
dc.contributor.authorChien, CHen_US
dc.contributor.authorLeu, CCen_US
dc.contributor.authorZhang, RJen_US
dc.contributor.authorWu, SCen_US
dc.contributor.authorHuang, TYen_US
dc.contributor.authorTseng, TYen_US
dc.date.accessioned2014-12-08T15:43:09Z-
dc.date.available2014-12-08T15:43:09Z-
dc.date.issued2001-12-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.40.L1333en_US
dc.identifier.urihttp://hdl.handle.net/11536/29213-
dc.description.abstractThe technique of low-pressure post-annealing process with additional second-step annealing for preparation of the Ba0.7Sr0.3TiO3 thin films deposited by liquid source misted chemical deposition (LSMCD) has been proposed. With employing this annealing procedure, the leakage current density can be significantly eliminated by approximately one order of magnitude at 2 V. In particular, process temperature can be reduced from 650 degreesC to 600 degreesC without suffering deteriorated crystallinity issue, which is identified by both C-V measurement and X-ray diffraction spectrum. The extracted dielectric constant is 310 with extreamly low loss tangent of 0.005. The spectrum of atomic force microscopy (AFM) shows that this low-pressure process results in smoother surface topography. Moreover, thermal desorption spectrums assure that less residual organics and contaminations were left after low pressure post-annealing. This may be one of the reasons for lowering crystallization temperature and the improved electrical properties.en_US
dc.language.isoen_USen_US
dc.subject(Ba,Sr)TiO3en_US
dc.subjectLSMCDen_US
dc.subjectlow pressure rapid thermal post-annealingen_US
dc.subjectprocess temperatureen_US
dc.subjectleakage current densityen_US
dc.subjectresidue organicsen_US
dc.titleThe effects of low-pressure rapid thermal post-annealing on the properties of (Ba,Sr)TiO3 thin films deposited by liquid source misted chemical depositionen_US
dc.typeArticleen_US
dc.identifier.doi10.1143/JJAP.40.L1333en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERSen_US
dc.citation.volume40en_US
dc.citation.issue12Aen_US
dc.citation.spageL1333en_US
dc.citation.epageL1335en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000172888800020-
dc.citation.woscount1-
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