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DC 欄位語言
dc.contributor.authorCHEN, HRen_US
dc.contributor.authorLEE, CPen_US
dc.contributor.authorCHANG, CYen_US
dc.contributor.authorTSANG, JSen_US
dc.contributor.authorTSAI, KLen_US
dc.date.accessioned2014-12-08T15:04:26Z-
dc.date.available2014-12-08T15:04:26Z-
dc.date.issued1993-07-15en_US
dc.identifier.issn0021-8979en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.354898en_US
dc.identifier.urihttp://hdl.handle.net/11536/2937-
dc.description.abstractAlGaAs/GaAs heterostructure emitter bipolar transistors were grown with emitter thicknesses varied from 300 to 900 angstrom and the emitter thickness effects on the current gain and offset voltage were studied. It was found that both the current gain and offset voltage are strongly dependent on the emitter thickness. The current gain decreases with increasing emitter thickness. For an emitter thickness smaller than 500 angstrom, the offset voltage decreases with increasing emitter thickness, but for an emitter thickness larger than 500 angstrom, the offset voltage stays at a nearly constant value. Offset voltage as low as 55 mV was obtained for an emitter thickness of 700 angstrom. This low offset voltage, mostly contributed by the geometric effect, indicates that the base-emitter junction is a homojunction. From the current gain and offset voltage considerations, the optimal emitter thickness was found to be about 300-500 angstrom.en_US
dc.language.isoen_USen_US
dc.titleTHE STUDY OF EMITTER THICKNESS EFFECT ON THE HETEROSTRUCTURE EMITTER BIPOLAR-TRANSISTORSen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.354898en_US
dc.identifier.journalJOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume74en_US
dc.citation.issue2en_US
dc.citation.spage1398en_US
dc.citation.epage1402en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1993LM78200099-
dc.citation.woscount11-
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