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dc.contributor.authorYeh, KLen_US
dc.contributor.authorLin, HCen_US
dc.contributor.authorHuang, RGen_US
dc.contributor.authorTsai, RWen_US
dc.contributor.authorHuang, TYen_US
dc.date.accessioned2014-12-08T15:43:37Z-
dc.date.available2014-12-08T15:43:37Z-
dc.date.issued2001-07-30en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.1390325en_US
dc.identifier.urihttp://hdl.handle.net/11536/29494-
dc.description.abstractConduction mechanisms for the off-state leakage in Schottky barrier thin-film transistor were explored. It was found that the field-emission process dominates the leakage conduction of the device with the conventional structure as the field strength in the drain junction becomes high, and results in the strong gate-induced drain leakage (GIDL) like phenomenon. In contrast, for the device with a field-induced-drain structure, the high-field region is pulled away from the silicided drain. As a result, the field-emission conduction is eliminated, so the GIDL-like leakage current is effectively suppressed. (C) 2001 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleConduction mechanisms for off-state leakage current of Schottky barrier thin-film transistorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.1390325en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume79en_US
dc.citation.issue5en_US
dc.citation.spage635en_US
dc.citation.epage637en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000170015900027-
dc.citation.woscount6-
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