標題: Application of A1/PI composite bumps to COG bonding process
作者: Jeng, JH
Hsieh, TE
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: A1/PI composite bumps;bonding;COG process;probing testability;reliability tests
公開日期: 1-六月-2001
摘要: This work demonstrates the probing, testability and applicability of Al/PI (aluminum/polyimide) composite bumps to the chip-on-glass (COG) bonding process for liquid crystal display (LCD) driver chip packaging. The experimental results showed that the thickness of Al overlayer on PI core of the bump, the location of pin contact, and the bump configuration affect bump probing testability. The bump with type IV configuration prepared in this work exhibited excellent probing testability when its Al overlayer thickness exceeded 0.8 mum. We further employed Taguchi method to identify the optimum COG bonding parameters for the Al/PI composite bump. The four bonding parameters, bonding temperature, bonding time, bonding pressure and thickness of Al overlayer are identified as 180 degreesC, 10 s, 800 kgf/cm(2) and 1.4 mum, respectively. The optimum bonding condition was applied to subsequent COG bonding experiments on glass substrates containing Al pads or indium tin oxide (ITO) pads. From the results of resistance measurement along with a series of reliability tests, Al pad is found to be good substrate bonding pad for Al/PI bump to COG process. Excellent contact quality was observed when the bumps had Al overlayer thickness over 1.1 mum. As to the COG specimens with substrate containing ITO pads, high joint resistance suggested that further contact quality refinement is necessary to realize their application to COG process.
URI: http://dx.doi.org/10.1109/6144.926393
http://hdl.handle.net/11536/29606
ISSN: 1521-3331
DOI: 10.1109/6144.926393
期刊: IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
Volume: 24
Issue: 2
起始頁: 271
結束頁: 278
顯示於類別:期刊論文


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