完整後設資料紀錄
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dc.contributor.authorLin, MSen_US
dc.contributor.authorChiu, CCen_US
dc.date.accessioned2014-12-08T15:43:50Z-
dc.date.available2014-12-08T15:43:50Z-
dc.date.issued2001-05-16en_US
dc.identifier.issn0021-8995en_US
dc.identifier.urihttp://dx.doi.org/10.1002/app.1177en_US
dc.identifier.urihttp://hdl.handle.net/11536/29641-
dc.description.abstractThis study addressed the blending and cocuring of resole and epoxy, using NaOH and 4,4'-diaminodiphenylmethane as curing agents. IR band shifts regarding the molecular interactions were investigated with FTIR. Exothermic peak shifts during cocuring reactions were studied with dynamic DSC. Viscosity increases were measured with a Brookfield LVT viscometer at 100 degreesC. The dynamic mechanical properties of the cocured samples were investigated using rheometric dynamic spectroscopy (RDS). Experimental results revealed that the molecular interactions between resole and epoxy resulted in good compatibility as shown by the single damping peak in the RDS curve and the single glass transition for each cocured sample. Also apparent were accelerated curing rates, leading to shifts of the exothermic peaks to lower temperature and faster viscosity increases. Nevertheless, enhanced gel fractions and increased glass-transition temperatures (T-g) of the samples were generally observed for this cocured system. The average molecular weight between crosslinked points calculated for the cocured materials also showed much less than the two components. These curing behaviors were quite different from those of the Interpenetrating Polymer Network (IPN) materials, which usually indicated lowered gel fractions, decreased T-g, and higher average molecular weight between crosslinkings than for components. (C) 2001 John Wiley & Sons, Inc.en_US
dc.language.isoen_USen_US
dc.titleDifferences in curing behavior of cocured and IPN materialsen_US
dc.typeArticleen_US
dc.identifier.doi10.1002/app.1177en_US
dc.identifier.journalJOURNAL OF APPLIED POLYMER SCIENCEen_US
dc.citation.volume80en_US
dc.citation.issue7en_US
dc.citation.spage963en_US
dc.citation.epage969en_US
dc.contributor.department應用化學系zh_TW
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.identifier.wosnumberWOS:000167438700009-
dc.citation.woscount5-
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