完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Tsai, MH | en_US |
dc.contributor.author | Whang, WT | en_US |
dc.date.accessioned | 2014-12-08T15:43:57Z | - |
dc.date.available | 2014-12-08T15:43:57Z | - |
dc.date.issued | 2001-04-01 | en_US |
dc.identifier.issn | 0032-3861 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1016/S0032-3861(00)00805-3 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/29718 | - |
dc.description.abstract | A new type of low dielectric polyimide/poly(silsesquioxane)-like (PI/PSSQ-like) hybrid nanocomposite material is successfully prepared from the polyimide (ODA-ODPA) precursor containing phenyltrialkoxysilane IPTS) at two chain ends and monoaryltrialkoxysilane with a self-catalyzed sol-gel process. We employ p-aminophenyltrimethoxysilane (APTS) to provide bonding between the PTS and ODPA-ODA phase, It is shown by transmission electron microscopy (TEM) and scanning electron microscopy (SEM) that the PSSQ-like domain sizes with uniform size are fairly well separated in the hybrid films. The silica domain sizes of 5000-PIS and 5000-PIS-50-PTS films are in the range of 30-100 nm, of 5000-PIS-100-PTS and 10000-PIS-100-PTS in the range of 80-200 and 300-600 nm, respectively. The dielectric constant can be 2.79 for 5000-PIS-140-PTS with fairly good mechanical properties. The PI/PSSQ-like hybrid films have higher onset decomposition temperature and char yield in thermogravimetric analysis (TGA) and higher T-g in differential scanning calorimetry (DSC) than the pure PI. Moreover, the PI/PSSQ-like hybrid films have excellent transparency even under high PTS content. In the series of X-PIS hybrid films, the coefficient of thermal expansion (CTE) below T-g increases with the PI block chain length, but in the series of X-PIS-y-PTS films, it slightly increases with the PTS content. However, above T-g the CTE of X-PIS and X-PIS-24-PTS is much lower than that of the pure PI. The dielectric constant and water absorption of X-PIS-V-PTS films decrease with the PTS content because of the higher free volume and hydrophobicity. (C) 2001 Elsevier Science Ltd. All rights reserved. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | PI/PSSQ-like | en_US |
dc.subject | nanocomposite | en_US |
dc.subject | low dielectric | en_US |
dc.title | Low dielectric polyimide/poly(silsesquioxane)-like nanocomposite material | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1016/S0032-3861(00)00805-3 | en_US |
dc.identifier.journal | POLYMER | en_US |
dc.citation.volume | 42 | en_US |
dc.citation.issue | 9 | en_US |
dc.citation.spage | 4197 | en_US |
dc.citation.epage | 4207 | en_US |
dc.contributor.department | 材料科學與工程學系 | zh_TW |
dc.contributor.department | Department of Materials Science and Engineering | en_US |
dc.identifier.wosnumber | WOS:000167050400029 | - |
dc.citation.woscount | 133 | - |
顯示於類別: | 期刊論文 |