完整後設資料紀錄
DC 欄位語言
dc.contributor.authorChen, RHen_US
dc.contributor.authorLan, CLen_US
dc.date.accessioned2014-12-08T15:44:09Z-
dc.date.available2014-12-08T15:44:09Z-
dc.date.issued2001-03-01en_US
dc.identifier.issn1057-7157en_US
dc.identifier.urihttp://dx.doi.org/10.1109/84.911093en_US
dc.identifier.urihttp://hdl.handle.net/11536/29816-
dc.description.abstractA fabrication process for complex ceramic microstructures was proposed that combines a lost mold technique and ceramic injection molding. Two key points in this process were studied. First, the solubility of several engineering plastics in various organic solvents was tested to find appropriate combinations of mold material and solvent for dissolving molds, Secondly, the binder extraction rate and the strength of a green body during debinding were investigated. Experimental results indicate that acrylonitrile-butadiene styrene and acetone are the best combinations selected for this lost mold technique. We also propose that using gasoline as the debinding solvent and performing the debinding at room temperature mill give a good time-saving effect and avoid toppling the microstructure if paraffin wax, stearic acid, and polyethylene were selected to compound the binder system. This process has been successfully applied to fabricate several ceramic microstructures, such as integrated punch.en_US
dc.language.isoen_USen_US
dc.subjectceramic injection moldingen_US
dc.subjectceramic microstructureen_US
dc.subjectextraction rateen_US
dc.subjectlost mold techniqueen_US
dc.subjectsolubilityen_US
dc.subjecttopplingen_US
dc.titleFabrication of high-aspect-ratio ceramic microstructures by injection molding with the altered lost mold techniqueen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/84.911093en_US
dc.identifier.journalJOURNAL OF MICROELECTROMECHANICAL SYSTEMSen_US
dc.citation.volume10en_US
dc.citation.issue1en_US
dc.citation.spage62en_US
dc.citation.epage68en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000167502000013-
dc.citation.woscount15-
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