完整後設資料紀錄
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dc.contributor.authorLin, CFen_US
dc.contributor.authorCheng, HCen_US
dc.contributor.authorChang, CCen_US
dc.contributor.authorChi, GCen_US
dc.date.accessioned2014-12-08T15:44:32Z-
dc.date.available2014-12-08T15:44:32Z-
dc.date.issued2000-12-01en_US
dc.identifier.issn0021-8979en_US
dc.identifier.urihttp://hdl.handle.net/11536/30060-
dc.description.abstractThe Mg accepters of GaN films are activated as p-type GaN with rapid thermal annealing (RTA) and furnace treatments. The GaN:Mg films are activated successfully by using the RTA system below 1000 degreesC for 1 min. After the RTA treatment, we observed a sharper linewidth and stronger emission intensities from donor to acceptor peaks in the photoluminescence spectra. By comparing the electrical properties of GaN:Mg films at optimum conditions made with RTA (800 degreesC) and furnace (700 degreesC) treatments, we find similar activated hole concentration and a higher hole mobility for GaN:Mg films with RTA treatment at 800 degreesC. A higher bulk resistivity caused by increasing nitrogen vacancies is found at higher temperature and longer time RTA treatments. Faster treatment times and lower temperatures for the GaN:Mg films were achieved with the RTA activation process. (C) 2000 American Institute of Physics. [S0021-8979(00)04120-7].en_US
dc.language.isoen_USen_US
dc.titleProperties of Mg activation in thermally treated GaN : Mg filmsen_US
dc.typeArticleen_US
dc.identifier.journalJOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume88en_US
dc.citation.issue11en_US
dc.citation.spage6515en_US
dc.citation.epage6518en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department奈米中心zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentNano Facility Centeren_US
dc.identifier.wosnumberWOS:000165543200055-
dc.citation.woscount7-
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