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dc.contributor.authorWu, Junen_US
dc.contributor.authorWang, Ying-Langen_US
dc.contributor.authorKua, Cheng-Tzuen_US
dc.date.accessioned2014-12-08T15:44:44Z-
dc.date.available2014-12-08T15:44:44Z-
dc.date.issued2008-02-01en_US
dc.identifier.issn0022-3697en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.jpcs.2007.11.020en_US
dc.identifier.urihttp://hdl.handle.net/11536/30198-
dc.description.abstractPrecipitates were observed on the surface of fluorine-doped silicon oxide (SiOF) films. These precipitates are flake-type and hexagonal in shape, showing up rapidly after initiation, and clustered at the wafer center. Post-deposition N(2)O plasma treatment (post-plasma treatment) was found to be most effective in inhibiting the appearance of precipitates. In this paper, effects of post-deposition N(2)O plasma treatment on the suppression of precipitates and stabilities of SiOF film were studied. X-ray photoelectron spectroscopy (XPS) analyses were conducted to investigate the changes in surface composition of SiOF films after N(2)O plasma treatment. The surface morphology of the film was characterized by atomic force microscopy (AFM). Cross-sectional transmission electron microscopy (TEM) images showed that a surface layer of 150 A was generated after N(2)O plasma treatment. The changes on surface structures of SiOF films caused by N(2)O plasma treatment and the consequent inhibition of precipitate formation were discussed. (c) 2007 Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectelectronic materialsen_US
dc.subjectsemiconductoren_US
dc.subjectthin filmen_US
dc.subjectvapor depositionen_US
dc.subjectdefecten_US
dc.titleEffects of plasma treatment on the precipitation of fluorine-doped silicon oxideen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/j.jpcs.2007.11.020en_US
dc.identifier.journalJOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDSen_US
dc.citation.volume69en_US
dc.citation.issue2-3en_US
dc.citation.spage555en_US
dc.citation.epage560en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000253874700064-
Appears in Collections:Conferences Paper


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