完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Pan, TM | en_US |
dc.contributor.author | Lei, TF | en_US |
dc.contributor.author | Chen, CC | en_US |
dc.contributor.author | Chao, TS | en_US |
dc.contributor.author | Liaw, MC | en_US |
dc.contributor.author | Yang, WL | en_US |
dc.contributor.author | Tsai, MS | en_US |
dc.contributor.author | Lu, CP | en_US |
dc.contributor.author | Chang, WH | en_US |
dc.date.accessioned | 2014-12-08T15:45:06Z | - |
dc.date.available | 2014-12-08T15:45:06Z | - |
dc.date.issued | 2000-07-01 | en_US |
dc.identifier.issn | 0741-3106 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1109/55.847373 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/30422 | - |
dc.description.abstract | Novel cleaning solutions were developed for post-CMP process, surfactant tetra methyl ammonium hydroxide (TMAH) and/or chelating agent ethylene diamine tetra acetic acid (EDTA) were added into the diluted ammonium hydroxide (NH4OH+H2O) alkaline aqueous solution to enhance removal of metallic and organic contamination, From the experimental result, it is found that the particle and metal removal efficiency and the electrical characteristics are significantly improved for post-CMP cleaning. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | cleaning | en_US |
dc.subject | CMP | en_US |
dc.subject | EDTA | en_US |
dc.subject | polysilicon | en_US |
dc.subject | TMAH | en_US |
dc.title | Novel cleaning solutions for polysilicon film post chemical mechanical polishing | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/55.847373 | en_US |
dc.identifier.journal | IEEE ELECTRON DEVICE LETTERS | en_US |
dc.citation.volume | 21 | en_US |
dc.citation.issue | 7 | en_US |
dc.citation.spage | 338 | en_US |
dc.citation.epage | 340 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000087898300004 | - |
dc.citation.woscount | 13 | - |
顯示於類別: | 期刊論文 |