Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applications

標題:	Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applications
作者:	Hu, JC Chang, TC Wu, CW Chen, LJ Hsiung, CS Hsieh, WY Lur, W Yew, TR 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics
公開日期:	1-七月-2000
摘要:	Effects of a new combination of additives in acid electroplating solution on the properties of Cu thin films have been investigated, The electroplated Cu films exhibit an excellent superfilling behavior. 0.18 mu m vias with an aspect ratio exceeding 5 were filled completely without any void or seam. Strong (111) texture was found for the electroplated Cu films. The resistivity of a 450-nm-thick Cu film was measured to be 1.84 mu Omega cm. (C) 2000 American Vacuum Society. [S0734-2101(00)08004-0].
URI:	http://dx.doi.org/10.1116/1.582326 http://hdl.handle.net/11536/30432
ISSN:	0734-2101
DOI:	10.1116/1.582326
期刊:	JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
Volume:	18
Issue:	4
起始頁:	1207
結束頁:	1210
顯示於類別：	會議論文

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