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dc.contributor.authorHu, JCen_US
dc.contributor.authorChang, TCen_US
dc.contributor.authorWu, CWen_US
dc.contributor.authorChen, LJen_US
dc.contributor.authorHsiung, CSen_US
dc.contributor.authorHsieh, WYen_US
dc.contributor.authorLur, Wen_US
dc.contributor.authorYew, TRen_US
dc.date.accessioned2014-12-08T15:45:07Z-
dc.date.available2014-12-08T15:45:07Z-
dc.date.issued2000-07-01en_US
dc.identifier.issn0734-2101en_US
dc.identifier.urihttp://dx.doi.org/10.1116/1.582326en_US
dc.identifier.urihttp://hdl.handle.net/11536/30432-
dc.description.abstractEffects of a new combination of additives in acid electroplating solution on the properties of Cu thin films have been investigated, The electroplated Cu films exhibit an excellent superfilling behavior. 0.18 mu m vias with an aspect ratio exceeding 5 were filled completely without any void or seam. Strong (111) texture was found for the electroplated Cu films. The resistivity of a 450-nm-thick Cu film was measured to be 1.84 mu Omega cm. (C) 2000 American Vacuum Society. [S0734-2101(00)08004-0].en_US
dc.language.isoen_USen_US
dc.titleEffects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applicationsen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1116/1.582326en_US
dc.identifier.journalJOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMSen_US
dc.citation.volume18en_US
dc.citation.issue4en_US
dc.citation.spage1207en_US
dc.citation.epage1210en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000088276800033-
Appears in Collections:Conferences Paper


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