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dc.contributor.authorLuo, JSen_US
dc.contributor.authorLin, WTen_US
dc.contributor.authorChang, CYen_US
dc.contributor.authorShih, PSen_US
dc.contributor.authorChang, TCen_US
dc.date.accessioned2014-12-08T15:45:14Z-
dc.date.available2014-12-08T15:45:14Z-
dc.date.issued2000-06-01en_US
dc.identifier.issn0168-583Xen_US
dc.identifier.urihttp://dx.doi.org/10.1016/S0168-583X(00)00029-Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/30491-
dc.description.abstractInterfacial reactions of Mo/Si0.76Ge0.24 were studied by pulsed KrF laser annealing as a function of the energy density and pulse number. Vacuum annealing was also performed on some samples for comparison. For the samples annealed at a temperature of 500-700 degrees C a continuous hexagonal Mo(Si1-xGex)(2) (h-Mo(Si1-xGex)(2)) film was formed, while Ge segregation from the h-Mo(Si1-xGex)(2) film to the underlying Si0.76Ge0.24 occurred with the extent becoming more severe at higher annealing temperatures. Concurrently, amorphous structures appeared in the Si0.76Ge0.24 substrate. At 700 degrees C h-Mo(Si1-xGex)(2) transformed to tetragonal Mo(Si1-xGex)(2) (t-Mo(Si1-xGex)(2)). Multiple-pulse laser annealing could produce a continuous h-Mo(Si1-xGex)(2) film without forming amorphous structures in the Si0.76Ge0.24 substrate, however, it could not suppress Ge segregation. In the present study, no t-Mo(Si1-xGex)(2) was formed upon pulsed KrF laser annealing even at higher energy densities. (C) 2000 Elsevier Science B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectMo(Si1-xGex)(2)en_US
dc.subjectpulsed KrF laser annealingen_US
dc.subjectGe segregationen_US
dc.subjectamorphous structuresen_US
dc.titlePulsed KrF laser annealing of Mo/Si0.76Ge0.24en_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/S0168-583X(00)00029-Xen_US
dc.identifier.journalNUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMSen_US
dc.citation.volume169en_US
dc.citation.issueen_US
dc.citation.spage129en_US
dc.citation.epage134en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000088184200025-
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