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dc.contributor.authorLee, CLen_US
dc.contributor.authorHo, JCen_US
dc.contributor.authorWei, KHen_US
dc.date.accessioned2014-12-08T15:45:31Z-
dc.date.available2014-12-08T15:45:31Z-
dc.date.issued2000-04-01en_US
dc.identifier.issn0032-3888en_US
dc.identifier.urihttp://hdl.handle.net/11536/30629-
dc.description.abstractThe cure kinetics of a high performance PR500 epoxy resin in the temperature range of 160-197 degrees C for the resin transfer molding (RTM) process have been investigated. The thermal analysis of the curing kinetics of PR500 resin was carried out by differential scanning calorimetry (DSC), with the ultimate heat of reaction measured in the dynamic mode and the rate of cure reaction and the degree of cure being determined under isothermal conditions. A modified Kamal's kinetic model was adapted to describe the autocatalytic and diffusion-controlled curing behavior of the resin. A reasonable agreement between the experimental data and the kinetic model has been obtained over the whole processing temperature range, including the mold filling and the final curing stages of the RTM process.en_US
dc.language.isoen_USen_US
dc.titleResin transfer molding (RTM) process of a high performance epoxy resin. I: Kinetic studies of cure reactionen_US
dc.typeArticleen_US
dc.identifier.journalPOLYMER ENGINEERING AND SCIENCEen_US
dc.citation.volume40en_US
dc.citation.issue4en_US
dc.citation.spage929en_US
dc.citation.epage934en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000086759300008-
dc.citation.woscount6-
Appears in Collections:Articles


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