Resin transfer molding (RTM) process of a high performance epoxy resin. I: Kinetic studies of cure reaction

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DC 欄位	值	語言
dc.contributor.author	Lee, CL	en_US
dc.contributor.author	Ho, JC	en_US
dc.contributor.author	Wei, KH	en_US
dc.date.accessioned	2014-12-08T15:45:31Z	-
dc.date.available	2014-12-08T15:45:31Z	-
dc.date.issued	2000-04-01	en_US
dc.identifier.issn	0032-3888	en_US
dc.identifier.uri	http://hdl.handle.net/11536/30629	-
dc.description.abstract	The cure kinetics of a high performance PR500 epoxy resin in the temperature range of 160-197 degrees C for the resin transfer molding (RTM) process have been investigated. The thermal analysis of the curing kinetics of PR500 resin was carried out by differential scanning calorimetry (DSC), with the ultimate heat of reaction measured in the dynamic mode and the rate of cure reaction and the degree of cure being determined under isothermal conditions. A modified Kamal's kinetic model was adapted to describe the autocatalytic and diffusion-controlled curing behavior of the resin. A reasonable agreement between the experimental data and the kinetic model has been obtained over the whole processing temperature range, including the mold filling and the final curing stages of the RTM process.	en_US
dc.language.iso	en_US	en_US
dc.title	Resin transfer molding (RTM) process of a high performance epoxy resin. I: Kinetic studies of cure reaction	en_US
dc.type	Article	en_US
dc.identifier.journal	POLYMER ENGINEERING AND SCIENCE	en_US
dc.citation.volume	40	en_US
dc.citation.issue	4	en_US
dc.citation.spage	929	en_US
dc.citation.epage	934	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000086759300008	-
dc.citation.woscount	6	-
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