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dc.contributor.authorLee, LSen_US
dc.contributor.authorLee, CLen_US
dc.date.accessioned2014-12-08T15:45:33Z-
dc.date.available2014-12-08T15:45:33Z-
dc.date.issued2000-03-16en_US
dc.identifier.issn0013-5194en_US
dc.identifier.urihttp://dx.doi.org/10.1049/el:20000379en_US
dc.identifier.urihttp://hdl.handle.net/11536/30650-
dc.description.abstractIt is demonstrated that Ar implantation can retard the epitaxial realignment of poly-Si/Si in an As- or P-doped n(+)-p poly-emitter diode during BF2 implantation. This is believed to be due to the gettering of As, P, and F by bubble-like defects created by the Ar implantation used to reduce the pile-up of these dopants at the poly-Si/Si interface. Consequently, there is less break-up of the interface oxide, resulting in a reduction in epitaxial realignment.en_US
dc.language.isoen_USen_US
dc.titleReduction of epitaxial alignment in n(+)-p poly-Si emitter diode due to gettering of P and As by Ar implantationen_US
dc.typeArticleen_US
dc.identifier.doi10.1049/el:20000379en_US
dc.identifier.journalELECTRONICS LETTERSen_US
dc.citation.volume36en_US
dc.citation.issue6en_US
dc.citation.spage579en_US
dc.citation.epage581en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000086381000066-
dc.citation.woscount0-
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